THERMAL PAD TO-218 .009" SP600
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| Series: | Sil-Pad® 600 | Manufacturer: | Bergquist | ||
| Usage: | TO-218, TO-220, TO-247 | Shape: | Rectangular | ||
| Outline: | 21.84mm x 18.79mm | Thickness: | 0.009" (0.229mm) | ||
| Propagation Delay Time : | 9.2 ns | Material: | Silicone Based | ||
| Adhesive: | - | Backing, Carrier: | - | ||
| Color: | Green | Thermal Resistivity: | 0.35°C/W |
| Technical/Catalog Information | SP600-90 |
| Vendor | Bergquist |
| Category | Fans, Thermal Management |
| Usage | TO-218 |
| Shape | Rectangular |
| Material | Silicone Elastomer |
| Thermal Conductivity | 1.6 W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Thickness | 0.009" (0.23mm) |
| Outline | 21.84mm x 18.79mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | SP600 90 SP60090 BER108 ND BER108ND BER108 |