HEATPAD TO-18
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| Technical/Catalog Information | SP900S-0.009-00-12-NA |
| Vendor | Bergquist |
| Category | Thermal Management |
| Usage | TO-18 |
| Shape | - |
| Material | Silicone/Fiberglass |
| Thermal Conductivity | 1.6 W/m-K |
| Thermal Resistivity | 0.6°C/W |
| Thickness | 0.009" (0.23mm) |
| Outline | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | SP900S 0 009 00 12 NA SP900S00090012NA |