Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology`Lower Input Capacitance`Improved Gate Charge`Extended Safe Operating Area`Lower Leakage Current : 25 A (Max.) @ VDS = 800V`Low RDS(ON) : 2.450 W (Typ.)cSpecifications Symbol Characteristic Value Units VDSS ...
SSF4N80AS: Features: `Avalanche Rugged Technology`Rugged Gate Oxide Technology`Lower Input Capacitance`Improved Gate Charge`Extended Safe Operating Area`Lower Leakage Current : 25 A (Max.) @ VDS = 800V`Low RDS...
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|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
800 |
V |
|
ID
|
Continuous Drain Current (TC=25 ) |
3.5 |
A |
|
Continuous Drain Current (TC=100 ) |
2.2 | ||
|
IDM |
Drain Current-Pulsed |
18 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
327 |
mJ |
|
IAR |
Avalanche Current |
3.5 |
A |
|
EAR |
Repetitive Avalanche Energy |
8.5 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
2.0 |
V/ns |
|
PD |
Total Power Dissipation (TC=25 ) Linear Derating Factor |
85 0.68 |
W W/ |
|
TJ , TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
|
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |