Application• 4 V drive• Low ON-resistance: Ron = 225 m (max) (@VGS = −4 V) Ron = 117 m (max) (@VGS = −10 V)Specifications Characteristic Symbol Rating Unit Drainsource voltage VDS −30 V Gatesource voltage VGSS ± 20 V Dr...
SSM3J117TU: Application• 4 V drive• Low ON-resistance: Ron = 225 m (max) (@VGS = −4 V) Ron = 117 m (max) (@VGS = −10 V)Specifications Characteristic Symbol Rating Unit ...
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|
Characteristic |
Symbol |
Rating |
Unit | |
|
Drainsource voltage |
VDS |
−30 |
V | |
|
Gatesource voltage |
VGSS |
± 20 |
V | |
|
Drain current |
DC |
ID |
−2 |
A |
|
Pulse |
IDP |
−4 | ||
|
Drain power dissipation |
PD (Note 1) |
800 |
mW | |
|
PD (Note 2) |
500 | |||
|
Channel temperature |
Tch |
150 |
°C | |
|
Storage temperature range |
Tstg |
−55 to 150 |
°C | |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Mounted on a ceramic board. (25.4 mm * 25.4 mm * 0.8 t, Cu Pad: 645 mm2 )
Note 2: Mounted on an FR4 board. (25.4 mm * 25.4 mm * 1.6 t, Cu Pad: 645 mm2 )