SST32HF164

Features: • MPF + SRAM ComboMemory SST32HF802: 512K x16 Flash + 128K x16 SRAM SST32HF162: 1M x16 Flash + 128K x16 SRAM SST32HF164: 1M x16 Flash + 256K x16 SRAM• Single 2.7-3.3V Read and Write Operations• Concurrent Operation Read from or write to SRAM while Erase/Program Flash&#...

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SST32HF164 Picture
SeekIC No. : 004505259 Detail

SST32HF164: Features: • MPF + SRAM ComboMemory SST32HF802: 512K x16 Flash + 128K x16 SRAM SST32HF162: 1M x16 Flash + 128K x16 SRAM SST32HF164: 1M x16 Flash + 256K x16 SRAM• Single 2.7-3.3V Read and ...

floor Price/Ceiling Price

Part Number:
SST32HF164
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• MPF + SRAM ComboMemory
SST32HF802: 512K x16 Flash + 128K x16 SRAM
SST32HF162: 1M x16 Flash + 128K x16 SRAM
SST32HF164: 1M x16 Flash + 256K x16 SRAM
• Single 2.7-3.3V Read and Write Operations
• Concurrent Operation Read from or write to SRAM while Erase/Program Flash
• Superior Reliability Endurance: 100,000 Cycles (typical) Greater than 100 years Data Retention
• Low Power Consumption: Active Current: 15 mA (typical) for Flash or SRAM Read Standby Current: 20 A (typical)
• Flexible Erase Capability Uniform 2 KWord sectors Uniform 32 KWord size blocks
• Fast Read Access Times: Flash: 70 ns and 90 ns SRAM: 70 ns and 90 ns
• Latched Address and Data for Flash
• Flash Fast Erase and Word-Program: Sector-Erase Time: 18 ms (typical) Block-Erase Time: 18 ms (typical) Chip-Erase Time: 70 ms (typical) Word-Program Time: 14 s (typical) Chip Rewrite Time: SST32HF802: 8 seconds (typical) SST32HF162/164: 15 seconds (typical)
• Flash Automatic Erase and Program Timing Internal VPP Generation
• Flash End-of-Write Detection Toggle Bit Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Package Available 48-lead TSOP (12mm x 20mm) 48-ball TBGA (10mm x 12mm) 48-ball LFBGA (6mm x 8mm)




Pinout

  Connection Diagram


Specifications

Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . .  . . .  . . .  . . . . . . -0.5V to VDD1 + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . .  . . . . . . . -1.0V to VDD1 + 1.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. VDD = VDDF and VDDS
2. Outputs shorted for no more than one second. No more than one output shorted at a time.



Description

The SST32HF164 ComboMemory devices integrate a 512K x16 or 1M x16 CMOS flash memory bank with a 128K x16 or 256K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST's proprietary, high performance SuperFlash technology.

Featuring high performance Word-Program, the flash memory bank provides a maximum Word-Program time of 14 sec. The entire flash memory bank can be erased and programmed word-by-word in typically 8 seconds for the SST32HF802 and 15 seconds for the SST32HF162/164, when using interface features such as Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent flash write, the SST32HF802/ 162/164 devices contain on-chip hardware and software data protection schemes.The SST32HF802/162/164 devices offer a guaranteed endurance of 10,000 cycles.

Data retention is rated at greater than 100 years. The SST32HF802/162/164 devices consist of two independent memory banks with respective bank enable signals.

The Flash and SRAM memory banks are superimposed in the same memory address space. Both memory banks share common address lines, data lines, WE# and OE#. The memory bank selection is done by memory bank enable signals. The SRAM bank enable signal, BES# selects the SRAM bank. The flash memory bank enable signal, BEF# selects the flash memory bank.

The WE# signal has to be used with Software Data Protection (SDP) command sequence when controlling the Erase and Program operations in the flash memory bank. The SDP command sequence protects the data stored in the flash memory bank from accidental alteration.

The SST32HF164 provide the added functionality of being able to simultaneously read from or write to the SRAM bank while erasing or programming in the flash memory bank. The SRAM memory bank can be read or written while the flash memory bank performs Sector- Erase, Bank-Erase, or Word-Program concurrently. All flash memory Erase and Program operations will automatically latch the input address and data signals and complete the operation in background without further input stimulus requirement. Once the internally controlled erase or program cycle in the flash bank has commenced, the SRAM bank can be accessed for read or write.

The SST32HF164 devices are suited for applications that use both flash memory and SRAM memory to store code or data. For systems requiring low power and small form factor, the SST32HF802/162/164 devices significantly improve performance and reliability, while lowering power consumption, when compared with multiple chip solutions. The SST32HF802/162/164 inherently use less energy during erase and program than alternative flash




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