SST32HF324C

Features: • ComboMemory organized as: 2M x16 Flash + 256K x16 SRAM• Single 2.7-3.3V Read and Write Operations• Concurrent Operation Read from or Write to SRAM whileErase/Program Flash• Superior Reliability Endurance: 100,000 Cycles (typical) Greater than 100 years Data Rete...

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SeekIC No. : 004505267 Detail

SST32HF324C: Features: • ComboMemory organized as: 2M x16 Flash + 256K x16 SRAM• Single 2.7-3.3V Read and Write Operations• Concurrent Operation Read from or Write to SRAM whileErase/Program Fl...

floor Price/Ceiling Price

Part Number:
SST32HF324C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• ComboMemory organized as:
2M x16 Flash + 256K x16 SRAM
• Single 2.7-3.3V Read and Write Operations
• Concurrent Operation
Read from or Write to SRAM while
Erase/Program Flash
• Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
• Low Power Consumption:
Active Current: 15 mA (typical) for
Flash or SRAM Read
Standby Current: 12 A (typical)
• Flexible Erase Capability
Uniform 2 KWord sectors
Uniform 32 KWord size blocks
• Erase-Suspend/Erase-Resume Capabilities
• Security-ID Feature
User: 128 bits
• Fast Read Access Times:
Flash: 70 ns
SRAM: 70 ns
• Latched Address and Data for Flash
• Flash Fast Erase and Word-Program:
Sector-Erase Time: 18 ms (typical)
Block-Erase Time: 18 ms (typical)
Chip-Erase Time: 40 ms (typical)
Word-Program Time: 7 s (typical)
• Flash Automatic Erase and Program Timing
Internal VPP Generation
• Flash End-of-Write Detection
Toggle Bit
Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Package Available
48-ball LBGA (10mm x 12mm x 1.4mm)
• All non-Pb (lead-free) devices are RoHS compliant



Specifications

Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  -20°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD1+0.3V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . .  -1.0V to VDD1.0V
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.0W
Surface Mount Solder Reflow Temperature2 . . . . . . . . . . . . . . . . . . . . . . . . . . .  260°C for 10 seconds
Output Short Circuit Current3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. VDD = VDDF and VDDS
2. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest information.
3. Outputs shorted for no more than one second. No more than one output shorted at a time.



Description

The SST32HF324C ComboMemory devices integrate a CMOS flash memory bank with a CMOS SRAM memory  bank in a Multi-Chip Package (MCP), manufactured with SST's proprietary, high-performance SuperFlash technology. 

Featuring high performance Word-Program, the flash memory bank provides a maximum Word-Program time of   sec. To protect against inadvertent flash write, the SST32HF324C devices contain on-chip hardware andsoftware data protection schemes. The SST32HF324C devices offer a guaranteed endurance of 10,000 cycles. Data retention is rated at greater than 100 years.

The SST32HF324C devices consist of two independent memory banks with respective bank enable signals. The Flash and SRAM memory banks are superimposed in the same memory address space. Both memory banks share common address lines, data lines, WE# and OE#. The memory bank selection is done by memory bank enable signals. The SRAM bank enable signal, BES# selects the SRAM bank. The flash memory bank enable signal, BEF#selects the flash memory bank. The WE# signal has to be used with Software Data Protection (SDP) command sequence when controlling the Erase and Program operations  in the flash memory bank. The SDP command  sequence protects the data stored in the flash memory bank from accidental alteration.

The SST32HF324C provide the added functionality of being able to simultaneously read from or write to the SRAM bank while erasing or programming in the flash memory bank. The SRAM memory bank can be read or written while the flash memory bank performs Sector- Erase, Bank-Erase, or Word-Program concurrently. All flash memory Erase and Program operations will automatically latch the input address and data signals and complete the operation in background without further input stimulus requirement. Once the internally controlled Erase or Program cycle in the flash bank has commenced, the SRAM bank can be accessed for Read or Write.

The SST32HF324C devices are suited for applications that use both flash memory and SRAM memory to store code or data. For systems requiring low power and small form factor, the SST32HF324C devices significantly improve performance and reliability while lowering power consumption when compared with multiple chip solutions. The SST32HF324C inherently use less energy during Erase and Program operations than alternative flash technologies.

The total energy consumed is a function of the applied voltage, current, and time of application. Since, for any given voltage range, SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies.




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