SST32HF401

Features: • MPF + SRAM ComboMemory SST32HF201: 128K x16 Flash + 64K x16 SRAM SST32HF202: 128K x16 Flash + 128K x16 SRAM SST32HF401: 256K x16 Flash + 64K x16 SRAM SST32HF402: 256K x16 Flash + 128K x16 SRAM• Single 2.7-3.3V Read and Write Operations• Concurrent Operation Read ...

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SST32HF401 Picture
SeekIC No. : 004505270 Detail

SST32HF401: Features: • MPF + SRAM ComboMemory SST32HF201: 128K x16 Flash + 64K x16 SRAM SST32HF202: 128K x16 Flash + 128K x16 SRAM SST32HF401: 256K x16 Flash + 64K x16 SRAM SST32HF402: 256K x16 Flash...

floor Price/Ceiling Price

Part Number:
SST32HF401
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• MPF + SRAM ComboMemory
    SST32HF201: 128K x16 Flash + 64K x16 SRAM
    SST32HF202: 128K x16 Flash + 128K x16 SRAM
    SST32HF401: 256K x16 Flash + 64K x16 SRAM
    SST32HF402: 256K x16 Flash + 128K x16 SRAM
• Single 2.7-3.3V Read and Write Operations
• Concurrent Operation
    Read from or write to SRAM while Erase/Program Flash
• Superior Reliability
    Endurance: 100,000 Cycles (typical)
    Greater than 100 years Data Retention
• Low Power Consumption:
   Active Current: 15 mA (typical) for Flash or SRAM Read
    Standby Current: 20 µA (typical)
• Flexible Erase Capability
    Uniform 2 KWord sectors
    Uniform 32 KWord size blocks
• Fast Read Access Times:
    Flash: 70 and 90 ns
    SRAM: 70 and 90 ns
• Latched Address and Data for Flash
• Flash Fast Erase and Word-Program:
    Sector-Erase Time: 18 ms (typical)
    Block-Erase Time: 18 ms (typical)
    Chip-Erase Time: 70 ms (typical)
    Word-Program Time: 14 µs (typical)
    Chip Rewrite Time:
  SST32HF201/202: 2 seconds (typical)
  SST32HF401/402: 4 seconds (typical)
• Flash Automatic Erase and Program Timing
    Internal VPP Generation
• Flash End-of-Write Detection
    Toggle Bit
    Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Conforms to Flash pinout
• Package Available
    48-ball LFBGA (6mm x 8mm)



Specifications

Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20 to +85
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +125
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.3V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . .-2.0V to VDD+2.0V
Package Power Dissipation Capability (Ta = 25) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . .240
Output Short Circuit Current1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA
 


Description

The SST32HF401 ComboMemory devices integrate a 128K x16 or 256K x16 CMOS flash memory bank with a 64K x16 or 128K x16 CMOS SRAM memory bank in a Multi-Chip Package (MCP), manufactured with SST's proprietary, high performance SuperFlash technology.
Featuring high performance Word-Program, the flash memory bank provides a maximum Word-Program time of 14 µsec. The entire flash memory bank can be erased and programmed word-by-word in typically 2 seconds for the SST32HF201/202 and 4 seconds for the SST32HF401/ 402, when using interface features such as Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent flash write, the SST32HF20x/40x devices contain on-chip hardware and software data protection schemes.The SST32HF20x/40x devices offer a guaranteed endurance of 10,000 cycles. Data retention is rated at greater than 100 years.
The SST32HF20x/40x devices consist of two independent memory banks with respective bank enable signals. The Flash and SRAM memory banks are superimposed in the same memory address space. Both memory banks share common address lines, data lines, WE# and OE#. The memory bank selection is done by memory bank enable signals. The SRAM bank enable signal, BES# selects the SRAM bank. The flash memory bank enable signal, BEF# selects the flash memory bank. The WE# signal has to be used with Software Data Protection (SDP) command sequence when controlling the Erase and Program operations in the flash memory bank. The SDP command sequence protects the data stored in the flash memory bank from accidental alteration.
The SST32HF401 provide the added functionality of being able to simultaneously read from or write to the SRAM bank while erasing or programming in the flash memory bank. The SRAM memory bank can be read or written while the flash memory bank performs Sector- Erase, Bank-Erase, or Word-Program concurrently. All flash memory Erase and Program operations will automatically latch the input address and data signals and complete the operation in background without further input stimulus requirement. Once the internally controlled Erase or Program cycle in the flash bank has commenced, the SRAM bank can be accessed for Read or Write.
The SST32HF20x/40x devices are suited for applications that use both flash memory and SRAM memory to store code or data. For systems requiring low power and small form factor, the SST32HF20x/40x devices significantly improve performance and reliability, while lowering power.




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