ST16ST2G

` 8 BIT ARCHITECTURE CPU
` 15 K Bytes of USER ROM
` 1 K Byte of T2G+ AUTHENTICATION LIBRARY
` 1.5 K Byte of SYSTEM ROM
` 384 Bytes of RAM
` Up to 16352 Bytes of EEPROM, SECTOR COMBINATIVE
   Highly reliable CMOS EEPROM technology
   10 year data retention
   100,000 Erase/Write cycle endurance
   Protected One Time Programmable block (32 or 64 bytes)
   1 to 32 Byte block Erase or Write in single cycle programming
` SERIAL ACCESS, ISO 7816-3 COMPATIBLE
` EXTENDED VOLTAGE OPERATION
   V_CC Range: 2.7 V to 5.5 V
   I_CC Operating:4 mA at 5 V (typical)
                              1.6 mA at 3 V (typical)
` POWER SAVING STANDBY MODE
   I<sub>CC</sub> Stand-by: 20 mA at 5 V (typical)
                              4 mA at 3 V (typical)
` UP TO 5 MHz INTERNAL OPERATING FREQUENCY
` VERY HIGH SECURITY FEATURES INCLUDING EEPROM FLASH ERASE
` CONTACT ASSIGNMENT COMPATIBLE ISO 7816-2
` ESD PROTECTION GREATER THAN 5000V
` 2 OPERATING CONFIGURATIONS
   ISSUER
   USER
` MEETS GSM 11.11 AND 11.12 SPECIFICATIONS Contact Name

The ST16ST2G, a member of the standard ST16SF4x device family, is a serial access microcontroller especially designed for high volume and cost competitive Smartcard applications where firmware security algorithm must be implemented.

The ST16ST2G is based on 8 bit CPU core and includes on chip memories: 384 Bytes of RAM, 15 K Bytes of USER ROM, 1.5 K Byte of SYSTEM ROM, and up to 16352 Bytes of EEPROM. The ST16ST2G also includes 1 KByte of T2G+ Authentication Library.

Both ROM and EEPROM memories can be configured into two sectors. Access rules from any memory section or sector to any other are set-up by the User's defined Memory Access Control Matrix (MACM).

Reliability data related to the ST16ST2G product manufactured using STMicroelectronics advanced CMOS EEPROM technology confirm data retention up to 10 years and endurance up to 100,000 Erase/Write cycles.

As with all other ST16 family members, the ST16ST2G is fully compatible with the ISO standards for Smartcard applications.

Software development (ROM code, options) can be completed by the ST16-19HDSE development system.

The ST16ST2G can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package.

For ordering information and request for quotation (RTQ) please contact your nearest ST sales office.