STD12NE06L

MOSFET RO 511-STD12NF06L

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SeekIC No. : 00166072 Detail

STD12NE06L: MOSFET RO 511-STD12NF06L

floor Price/Ceiling Price

Part Number:
STD12NE06L
Mfg:
STMicroelectronics
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2026/1/16

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 12 A
Resistance Drain-Source RDS (on) : 0.09 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : TO-252 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Packaging : Tube
Package / Case : TO-252
Continuous Drain Current : 12 A
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 0.09 Ohms


Features:

  ` TYPICAL RDS(on) = 0.09  
  ` EXCEPTIONAL dv/dt CAPABILITY
  ` AVALANCHERUGGED TECHNOLOGY
  ` 100% AVALANCHE TESTED
  ` APPLICATIONORIENTED CHARACTERIZATION
  ` ADD SUFFIX "T4" FORORDERING IN TAPE & REEL



Application

  · DC MOTOR CONTROL (DISK DRIVES,etc.)
  · DC-DC & DC-AC CONVERTERS
  · SYNCHRONOUS RECTIFICATION



Specifications

Symbol Parameter
Value
Unit
VDS Collector-Source Voltage (VGS = 0 V)
60
V
VDGR Drain-gate Voltage (RGS = 20 k)

60

V
VGS Gate-Source Voltage
±20
V
ID Drain Current (continuous) at TC = 25
12
A
ID Drain Current (continuous) at TC = 100
8
A
IDM () Drain Current (pulsed)
48
A
Ptot Total Dissipation at TC = 25
35
W
Derating Factor
0.23
W/
dv/dt(1) Peak Diode Recovery voltage slope
6
V/ns
Tstg Storage Temperature
-65 to 175
Tj Max. Operating Junction Temperature
175
(`) Pulse width limited by safe operating area.
(1) ISD 12A, di/dt 200A/s, VDD V(BR)DSS, Tj TJMAX


Description

™This Power MOSFET STD12NE06L is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.




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