STD2NB80

MOSFET N-Ch 800 Volt 1.9Amp

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STD2NB80 Picture
SeekIC No. : 00165081 Detail

STD2NB80: MOSFET N-Ch 800 Volt 1.9Amp

floor Price/Ceiling Price

Part Number:
STD2NB80
Mfg:
STMicroelectronics
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/28

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 800 V
Gate-Source Breakdown Voltage : +/- 30 V Continuous Drain Current : 1.9 A
Resistance Drain-Source RDS (on) : 6.5 Ohms Configuration : Single
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : TO-252 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Configuration : Single
Mounting Style : SMD/SMT
Maximum Operating Temperature : + 150 C
Packaging : Tube
Gate-Source Breakdown Voltage : +/- 30 V
Package / Case : TO-252
Drain-Source Breakdown Voltage : 800 V
Resistance Drain-Source RDS (on) : 6.5 Ohms
Continuous Drain Current : 1.9 A


Features:

 TYPICAL RDS(on) = 4.6 W
 EXTREMELY HIGH dv/dt CAPABILITY
 100% AVALANCHE TESTED
 VERY LOW INTRINSIC CAPACITANCES
 GATE CHARGE MINIMIZED
 ADD SUFFIX "T4" FORORDERING IN TAPE & REEL (2500 UNITS)



Application

 SWITCH MODE POWER SUPPLIES(SMPS)
 DC-AC CONVERTERS FOR WELDING EQUIPMENTAND
   UNINTERRUPTIBLE POWERSUPPLIES AND MOTOR DRIVE



Specifications

Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
800
V

VDGR

Drain- gate Voltage (RGS = 20 kW)

800

V

VGE
Gate-Emitter Voltage
± 30
V

ID

Drain Current (continuous) at TC = 25°C

1.9

A

ID
Drain Current (continuous) at TC = 100°C
1.2

A
IDM ()
Drain Current (pulsed)
7.6
A
PTOT
Total Dissipation at TC = 25°C
55
W
Derating Factor
0.44
W/°C
dv/dt (1)
Peak Diode Recovery voltage slope
4.5
V/ns

Tstg

Storage Temperature

- 65 to 150

°C

Tj

Max. Operating Junction Temperature

150

°C




Description

Using the latest high voltage MESH OVERLAY] process, STD2NB80 STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.




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