Features: • Avalanche rugged technology.• Low input capacitance.• Low leakage current : 10 ㎂ (Max.) @ VDS=200V.• Low RDS(on) : 0.30(Typ.)Specifications Characteristic Symbol Rating Unit Drain-source voltage VDSS 200 V Gate-source voltage ...
STK630F: Features: • Avalanche rugged technology.• Low input capacitance.• Low leakage current : 10 ㎂ (Max.) @ VDS=200V.• Low RDS(on) : 0.30(Typ.)Specifications Characteri...
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Specifications Absolute maximum ratingsOutput pin variationLead pinsVCE max [V]600VCC max [V]450...
| Characteristic |
Symbol |
Rating |
Unit | |
| Drain-source voltage |
VDSS |
200 |
V | |
| Gate-source voltage |
VGSS |
±30 |
V | |
| Drain current (DC) * |
ID |
TC=25 |
9 |
A |
|
TC=100 |
5.7 | |||
| Drain current (Pulsed) * |
IDP |
36 |
A | |
| Drain power dissipation (TC=25) |
PD |
30 |
W | |
| Single pulsed avalanche energy |
EAS |
162 |
mJ | |
| Avalanche current (Repetitive) |
IAR |
9 |
A | |
| Repetitive avalanche energy |
EAR |
7.2 |
mJ | |
| Peak diode recovery dv/dt |
dv/dt |
5.0 |
V/㎱ | |
| Junction temperature |
TJ |
150 |
°C | |
| Storage temperature range |
Tstg |
-55~150 |
°C | |