Features: TYPICAL RDS(on) = 0.025W IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGEApplicationHIGH EFFICIENCY ISOLATED DC/DCCONVETERSSpecifications Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 100 V VDGR Drain-gate Voltage (RGS = 20 k ) 100 V V...
STL35NF10: Features: TYPICAL RDS(on) = 0.025W IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGEApplicationHIGH EFFICIENCY ISOLATED DC/DCCONVETERSSpecifications Symbol Parameter Value Unit ...
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Features: TYPICAL RDS(on) = 0.008 IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGEApplica...
| Symbol | Parameter | Value | Unit |
| VDS | Drain-source Voltage (VGS = 0) | 100 | V |
| VDGR | Drain-gate Voltage (RGS = 20 k ) | 100 | V |
| VGS | Gate- source Voltage | ± 20 | V |
| ID | Drain Current (continuos) at TC = 25 Drain Current (continuos) at TC = 100 |
35 22 |
A A |
| IDM | (l) Drain Current (pulsed) | 140 | A |
| PTOT | Total Dissipation at TC = 25 | 80 | W |
| Derating Factor | 0.64 | W/°C | |
| EAS(1) | Single Pulse Avalanche Energy | 135 | mJ |
| Tstg | Storage Temperature | 65 to 150 | °C |
| Tj | Max. Operating Junction Temperature | 55 to 150 | °C |
This Power MOSFET STL35NF10 is the second generation of TMicroelectronics unique "STripFET™" technology.The resulting transistor shows extremely low onresistanceand minimal gate charge. The new PowerFLAT™ package allows a significant reduction inboard space without compromising performance.