STP36NF06

MOSFET N-Ch 60 Volt 30 Amp

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SeekIC No. : 00148812 Detail

STP36NF06: MOSFET N-Ch 60 Volt 30 Amp

floor Price/Ceiling Price

US $ .39~.63 / Piece | Get Latest Price
Part Number:
STP36NF06
Mfg:
STMicroelectronics
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~250
  • Unit Price
  • $.63
  • $.55
  • $.45
  • $.39
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 30 A
Resistance Drain-Source RDS (on) : 40 mOhms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : Through Hole
Package / Case : TO-220 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : Through Hole
Packaging : Tube
Package / Case : TO-220
Continuous Drain Current : 30 A
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 40 mOhms


Application

 HIGH CURRENT, HIGH SWITCHING SPEED


Specifications

Symbol
Parameter
Value
Unit
STP10NK80Z
STP10NK80ZFP
VDS
Drain-source Voltage (VGS = 0)
60
V
VDGR
Drain- gate Voltage (RGS = 20 k)
60
V
VGS
Gate-Source Voltage
± 20
V
ID
Drain Current (continuous) at Tc = 25
30
18 (*)
A
ID

Drain Current (continuous) at Tc = 100
21
12
A
IDM(`)
Drain Current (pulsed)
120
72
A
PTOT(1)
Total Dissipation at Tc = 25
70
25
W
Derating Factor
0.47
0.17
W/
dv/dt (1)
Gate source ESD(HBM-C=100pF, R=1.5KW)
20
V/ns
EAS (2)
Peak Diode Recovery voltage slope
200
mJ
Tstg
Storage Temperature
-55 to 175

Tj Operating Junction Temperature
(•)Pulse width limited by safe operating area (1)ISD36A, di/dt400A/µs, VDD(BR)DSS, Tj0TJMAX
(3) Starting Tj = 25 , ID = 18A, VDD = 45V (*) Current Limited by Package


Description

This Power MOSFET STP36NF06 is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.




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