SW-277

Features: • Positive Supply and Control Voltages• +36 dBm Typ. 1 dB Compression Point, 8V Supply• +65 dBm Typ. 3rd Order Intercept Point, 8V Supply• Low Insertion Loss: 0.4 dB Typical• Low Power Consumption: 100 µW• Fast Switching Speed• Tape and Ree...

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SW-277 Picture
SeekIC No. : 004509632 Detail

SW-277: Features: • Positive Supply and Control Voltages• +36 dBm Typ. 1 dB Compression Point, 8V Supply• +65 dBm Typ. 3rd Order Intercept Point, 8V Supply• Low Insertion Loss: 0.4 d...

floor Price/Ceiling Price

Part Number:
SW-277
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/25

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Product Details

Description



Features:

• Positive Supply and Control Voltages
• +36 dBm Typ. 1 dB Compression Point, 8V Supply
• +65 dBm Typ. 3rd Order Intercept Point, 8V Supply
• Low Insertion Loss: 0.4 dB Typical
• Low Power Consumption: 100 µW
• Fast Switching Speed
• Tape and Reel Packaging Available1



Specifications

Parameter
Absolute Maximum

Max. Input Power
0.5 2.0 GHz
5V Control and Supply
8V Control and Supply
10V Control and Supply
Power Dissipation
Control Voltage
Operating Temperature
Storage Temperature


+37 dBm
+40 dBm
+42 dBm
1.0 W
-1V, +12V
-1V, Vsupply + 0.2V
-40°C to +85°C
-65°C to +150°C
Thermal Resistance2:   jc = 87 °C/W

1. Operation of this device above any one of these parameters may cause permanent damage.
2. Thermal resistance is given for TA = 25°C. TCASE is the temperature of leads 1 and 4.




Description

M/A-COM's SW-277 is a GaAs MMIC SPDT switch in a low cost SOIC 8-lead surface mount plastic package. The SW-277 is ideally suited for use where very low power consumption is required. Typical applications include transmit/receive switching, switch matrices, and filter banks in systems such as: radio and cellular equipment, PCM, GPS, fiber optic modules, and other battery powered radio equipment.

The SW-277 is fabricated with a monolithic GaAs MMIC using a mature 1-micron process. The process features full chip passivation for increased performance and reliability.




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