SW-461

• High Isolation: 40 dB
• Low Current draw: < 2mA @ +5 V 
                                  < 10mA @ -5V
• 5V CMOS Logic
• 45mm PBGA Package
• JEDEC MO-151 Foot Print

M/A-COM's SW-461 is a multi-chip module containing six SP4T GaAs switches, each with a driver/decoder and four GaAs 6-way power dividers. The SW-461 utilizes Plastic Ball Grid Array (PBGA) interconnect technology to achieve high circuit density and superior high frequency performance. This device is ideal for telephony applications in the AMPS frequency bands.

The SW-461 is constructed with a multi layer PCB using a ball grid array for the I/O connects. The combination of several state-of-the-art technologies achieves high performance at a low cost.