Features: SpecificationsDescription The SZAF07 has some features: 1.Package: SMT Solderability; 2.Dimension : 3.8 * 1.05 * 0.6 (mm); 3.Low Thermal Resistance; 4.RoHS Compliant, Lead Free; 5.Suitable for Small Applications; 6.High ESD Voltage;7.Own Patent Reserved; 8.SZAF07 is Very Useful Side View...
SZAF07: Features: SpecificationsDescription The SZAF07 has some features: 1.Package: SMT Solderability; 2.Dimension : 3.8 * 1.05 * 0.6 (mm); 3.Low Thermal Resistance; 4.RoHS Compliant, Lead Free; 5.Suitable...
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The SZAF07 has some features: 1.Package: SMT Solderability; 2.Dimension : 3.8 * 1.05 * 0.6 (mm); 3.Low Thermal Resistance; 4.RoHS Compliant, Lead Free; 5.Suitable for Small Applications; 6.High ESD Voltage;7.Own Patent Reserved; 8.SZAF07 is Very Useful Side View LED in Back Light Unit Application.The SZAF07 also has some applications:1. Flat Backlighting (LCD, Display); 2.Mobile Phone, Camera, PDA, Notebook; 3.Coupling into Light Guide Panel; 4.AV Systems.
The SZAF07's absolute maximum ratings are as following, Parameter: Power Dissipation, symbol:Pd*1, value=120mW; Parameter: Forward Current, symbol: IF, value=30mA; Parameter:Peak Forward Current, symbol:IFM*2 , value=100 mA; Parameter:Reverse Voltage, symbol:VR, value=5 V;Parameter: Operating Temperature , symbol:Topr, value is -30 ~ +85 °C ; Parameter: Storage Temperature , symbol: Tstg, value is -40 ~ +100 °C ;Parameter:Junction Temperature symbol:Tj, value=125 °C. *1 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product.*2 IFM conditions : Pulse width TW 0.1ms, Duty ratio 1/10.
There are some tips of SZAF07: (1) Storage conditions.Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH.In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.(2) When soldering, this could result in a decrease of the photoelectric effect or light intensity. (3)Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling.The product should not be mounted on a distorted part of PCB.(4)When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used and IPA(Isopropyl Alcohol) must be used.(5) When using the product, operating current should be settled in consideration of the maximum ambient temperature.SZAF07's appearance or specification for improvement is subject to change without notice.