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Features: · TrenchFET® Power MOSFET· New MICRO FOOT® Chipscale Packaging Reduces Footprint Area, Profile (0.62 mm) and On-Resistance Per Footprint Area· Pin Compatible to Si8401DBApplicationLoad Switch, Battery Switch, and PA Switch for Portable DevicesSpecifications Parameter IR...

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SeekIC No. : 004490852 Detail

Si8409DB: Features: · TrenchFET® Power MOSFET· New MICRO FOOT® Chipscale Packaging Reduces Footprint Area, Profile (0.62 mm) and On-Resistance Per Footprint Area· Pin Compatible to Si8401DBApplication...

Si8409DB Data Sheet

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Part Number:: Si8409DB
Supply Ability:: 5000

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1~5000

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Processing time
15 Days

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Upload time: 2025/12/25

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Product Details

Description

Features:

· TrenchFET^® Power MOSFET
· New MICRO FOOT^® Chipscale Packaging Reduces Footprint Area, Profile (0.62 mm) and On-Resistance Per Footprint Area
· Pin Compatible to Si8401DB

Application

Load Switch, Battery Switch, and PA Switch for Portable Devices

Specifications

Parameter		IR/Convection	5 secs	Steady State	Unit
Drain-Source Voltage		V_DS	−30		V
Gate-Source Voltage		V_GS	±12
Continuous Drain Current (TJ = 150)a	TA = 25	I_D	−6.3	−4.6	A
	TA = 70		−5.1	−3.7
Pulsed Drain Current		I_DM	−25
continuous Source Current (Diode Conduction)a		I_S	−2.5	−1.3
Maximum Power Dissipationa	T_A = 25	P_D	2.77	1.47	W
	T_A = 70		1.77	0.94
Operating Junction and Storage Temperature Range		T_J, T_stg	−55 to 150
Package Reflow Conditionsb	VPR		215
	IR/Convection		220

Description

P-Channel 30-V (D-S) MOSFET
Si8409DB

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Si8409DB

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