SI9925DY

MOSFET 20V 5A 5W

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SI9925DY Picture
SeekIC No. : 00166074 Detail

SI9925DY: MOSFET 20V 5A 5W

floor Price/Ceiling Price

Part Number:
SI9925DY
Mfg:
Vishay/Siliconix
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/25

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 20 V
Gate-Source Breakdown Voltage : +/- 12 V Continuous Drain Current : 5 A
Resistance Drain-Source RDS (on) : 50 mOhms Configuration : Dual
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOIC-8 Narrow    

Description

Packaging :
Transistor Polarity : N-Channel
Mounting Style : SMD/SMT
Maximum Operating Temperature : + 150 C
Drain-Source Breakdown Voltage : 20 V
Configuration : Dual
Package / Case : SOIC-8 Narrow
Gate-Source Breakdown Voltage : +/- 12 V
Continuous Drain Current : 5 A
Resistance Drain-Source RDS (on) : 50 mOhms


Features:

· Low on-state resistance
· Fast switching
· TrenchMOS™ technology



Application

· DC to DC convertors
· DC motor control
· Lithium-ion battery applications
· Notebook PC
· Portable equipment applications



Pinout

  Connection Diagram


Specifications

Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage (DC) Tj = 25 to 150 °C - 20 V
VGS gate-source voltage (DC)   - ±12 V
ID drain current (DC) Tamb = 25 °C; pulsed; tp 10 s; Figure 2 and 3 - 5 A
Tamb = 70 °C; pulsed; tp 10 s; Figure 2 4
IDM peak drain current Tamb = 25 °C; pulsed; tp 10 ms; Figure 3 - 48 A
Ptot total power dissipation Tamb = 25 °C; pulsed; tp 10 s; Figure 1 - 2 W
Tamb = 70 °C; pulsed; tp 10 s; Figure 1 1.3
Tstg storage temperature   -55 +150 °C
Tj operating junction temperature   -55 +15 °C
Source-drain diode
IS source (diode forward) current (DC) Tamb = 25 °C - 1.3 A



Description

Dual N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS™1 technology.Product availability: Si9925DY in SOT96-1 (SO8).


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