Features: • Low Gate Charge Qg Results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and Current• Effective Coss specified (AN 1001)• Lead (Pb)-free AvailableApplication•...
SiHF740AS: Features: • Low Gate Charge Qg Results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and...
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Characteristics |
Symbol |
Rating |
Unit | ||
| Drain - source voltage |
VDS |
400 |
V | ||
| Gate - source voltage |
VGS |
±30 | |||
| Continuous Drain current | VGS at 10 V | TC = 25 |
ID |
10 |
A |
| TC = 100 |
6.3 | ||||
| Pulsed Drain Currenta, e |
IDM |
40 | |||
| Linear Derating Factor |
1.0 |
W/ | |||
| Single pulse avalanche Energy e |
EAS |
630 |
mJ | ||
| Avalanche current |
IAR |
10 |
A | ||
| Repetitive avalanche Energya |
EAR |
12.5 |
mJ | ||
| Maximum Power Dissipation | TA = 25 |
PD |
3.1 |
W | |
| TC = 25 |
125 | ||||
| Peak Diode Recovery dV/dtc, e |
dV/dt |
5.9 |
V/ns | ||
| Operating Junction and Storage Temperature Range |
TJ, Tstg |
- 55 to + 150 |
|||
| Soldering Recommendations (Peak Temperature) | for 10 s |
300d | |||