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SiHF9Z14S

Features: • Advanced Process Technology• Surface Mount (IRF9Z14S/SiHF9Z14S)• Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)• 175 Operating Temperature• Fast Switching• P-Channel• Fully Avalanche Rated• Lead (Pb)-free AvailableSpecifications PARAMET...

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SeekIC No. : 004491158 Detail

SiHF9Z14S: Features: • Advanced Process Technology• Surface Mount (IRF9Z14S/SiHF9Z14S)• Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)• 175 Operating Temperature• Fast Switching...

SiHF9Z14S Data Sheet

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Part Number:
SiHF9Z14S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/25

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Product Details

Description



Features:

• Advanced Process Technology
• Surface Mount (IRF9Z14S/SiHF9Z14S)
• Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)
• 175 Operating Temperature
• Fast Switching
• P-Channel
• Fully Avalanche Rated
• Lead (Pb)-free Available




Specifications

PARAMETER
SYMBOL
LIMIT
UNTI
Drain-Source Voltagee
VDS
-60
V
Gate-Source Voltagee
VGS
±20
Continuous Drain Current e,VGS at - 10 V TC = 25
ID
-6.7
A
TC = 100
-4.7
Pulsed Drain Currenta,e
IDM
-27
Linear Derating Factor  
0.29
W/
Single Pulse Avalanche Energyb, e
EAS
140
mJ
Repetitive Avalanche Currenta
IAR
-6.7
A
Repetitive Avalanche Energya
EAR
4.3
mJ

Maximum Power Dissipation

 TC = 25
PD
3.7
W
TA = 25
43
* Pb containing terminations are not RoHS compliant, exemptions may apply




Description

Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit of IRF9Z14L/SiHF9Z14L, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. IRF9Z14L/SiHF9Z14L provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of is low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.

The through-hole version (IRF9Z14L/SiHF9Z14L) is available for low-profile applications.






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