Features: • Advanced Process Technology• Surface Mount (IRF9Z34S/SiHF9Z34S)• Low-Profile Through-Hole (IRSiHF9Z34L/SiHF9Z34L)• 175 Operating Temperature• Fast Switching• P-Channel• Fully Avalanche Rated• Lead (Pb)-free AvailableSpecifications PAR...
SiHF9Z34S: Features: • Advanced Process Technology• Surface Mount (IRF9Z34S/SiHF9Z34S)• Low-Profile Through-Hole (IRSiHF9Z34L/SiHF9Z34L)• 175 Operating Temperature• Fast Switchin...
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|
PARAMETER |
SYMBOL |
LIMIT |
UNTI | |
| Drain-Source Voltagee |
VDS |
-60 |
V | |
| Gate-Source Voltagee |
VGS |
±20 | ||
| Continuous Drain Current e,VGS at - 10 V | TC = 25 |
ID
|
-18 |
A |
| TC = 100 |
-13 | |||
| Pulsed Drain Currenta,e |
IDM
|
-72 | ||
| Linear Derating Factor |
0.59 |
W/ | ||
| Single Pulse Avalanche Energyb, e |
EAS |
370 |
mJ | |
| Repetitive Avalanche Currenta |
IAR |
-18 |
A | |
| Repetitive Avalanche Energya |
EAR |
8.8 |
mJ | |
Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit of IRSiHF9Z34L/SiHF9Z34L, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2PAK is a surface mount power package capable of accommodating die sizes up to HEX-4. IRSiHF9Z34L/SiHF9Z34L provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.
The through-hole version (IRSiHF9Z34L/SiHF9Z34L) is available for low-profile applications.