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SiHFBC30S

Features: • Surface Mount (IRFBC30S, SiHFBC30S)• Low-Profile Through-Hole (IRFBC30L, SiHFBC30L)• Available in Tape and Reel (IRFBC30S,SiHFBC30S)• Dynamic dV/dt Rating• 150 Operating Temperature• Fast Switching• Fully Avalanche Rated• Lead (Pb)-free ...

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SeekIC No. : 004491167 Detail

SiHFBC30S: Features: • Surface Mount (IRFBC30S, SiHFBC30S)• Low-Profile Through-Hole (IRFBC30L, SiHFBC30L)• Available in Tape and Reel (IRFBC30S,SiHFBC30S)• Dynamic dV/dt Rating• ...

SiHFBC30S Data Sheet

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Part Number:
SiHFBC30S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Surface Mount (IRFBC30S, SiHFBC30S)
• Low-Profile Through-Hole (IRFBC30L, SiHFBC30L)
• Available in Tape and Reel (IRFBC30S,SiHFBC30S)
• Dynamic dV/dt Rating
• 150 Operating Temperature
• Fast Switching
• Fully Avalanche Rated
• Lead (Pb)-free Available


Specifications

Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
600
V
Gate-Source Voltage
VGS
±20
V
Drain Current-Continuous e VGS at 10 V TC=25
ID
3.6
2.3
A
TC=100
Pulsed Drain Currenta e
IDM
14
A
Linear Derating Factor
0.59
W/
Single Pulse Avalanche Energyb e
EAS
290
mJ
Repetitive Avalanche Currenta
IAR
3.6
A
Repetitive Avalanche Energye
EAR
7.4
mJ
Maximum Power Dissipation TC=25
PD
3.1
74
W
Ta=25
Peak Diode Recovery dV/dtc
dV/dt
3.0
V/ns
Operating Junction and S torage
Temperature R ange
TJ, TSTG
-55 to 150
Soldering Recommendations (Peak Temperature) for 10 s
300d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 25 V, starting TJ = 25 , L = 16 mH, RG = 25 , IAS = 2.7 A (see fig. 12).
c. ISD 10 A, dI/dt 90 A/s, VDD VDS, TJ 150 .
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply


Description

Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK is a surface mount power package capable of the accommodating die sizes up to HEX-4. IRFBC30L, SiHFBC30L provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.

The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRFBC30L, SiHFBC30L) is a available for low-profile applications.




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