Features: • Low Gate Charge Qg Results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and Current• Effective Coss Specified• Lead (Pb)-free AvailableApplication• Switch Mo...
SiHFR430A: Features: • Low Gate Charge Qg Results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and...
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• Low Gate Charge Qg Results in Simple Drive Requirement
• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness
• Fully Characterized Capacitance and Avalanche Voltage and Current
• Effective Coss Specified
• Lead (Pb)-free Available
|
Parameter |
Symbol |
LIMIT |
Unit | |
| Drain-Source Voltage |
VDS |
500 |
V | |
| Gate-Source Voltage |
VGS |
±30 |
V | |
| Continuous Drain Current TC=25 TC=100 |
ID |
5.0 3.2 |
A | |
| Pulsed Drain Current |
IDM |
20 |
A | |
| Linear Derating Factor |
0.91 |
W/ | ||
| Avalanche Current |
IAR |
5.0 |
A | |
| Repetitive avalanche energy |
EAR |
11 |
mJ | |
| Single pulsed avalanche energy |
EAS |
130 |
mJ | |
| Peak diode recovery dv/dt |
dv/dt |
3.0 |
V/ns | |
| Power Dissipation |
PD |
110 |
W | |
| Junction and Storage Temperature Range |
TJ,TSTG |
-55 to 150 |
||
| Soldering Recommendations (Peak Temperature) for 10 s |
300 |
|||