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SiHFR9220

Features: • Dynamic dV/dt Rating• Repetitive Avalanche Rated• Surface Mount (IRFR9220/SiHFR9220)• Straight Lead (IRFUFU9220/SiHFU9220)• Available in Tape and Reel• P-Channel• Fast Switching• Lead (Pb)-free AvailableSpecifications PARAMETER SYMBOL...

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SiHFR9220: Features: • Dynamic dV/dt Rating• Repetitive Avalanche Rated• Surface Mount (IRFR9220/SiHFR9220)• Straight Lead (IRFUFU9220/SiHFU9220)• Available in Tape and Reel•...

SiHFR9220 Data Sheet

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Part Number:
SiHFR9220
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/25

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Product Details

Description



Features:

• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR9220/SiHFR9220)
• Straight Lead (IRFUFU9220/SiHFU9220)
• Available in Tape and Reel
• P-Channel
• Fast Switching
• Lead (Pb)-free Available




Specifications

PARAMETER
SYMBOL
LIMIT
 UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
- 200
± 20
V
Continuous Drain Current VGS at -10V TC = 25
TC = 100
ID

IDM
- 3.6
- 2.3
- 14
A
Pulsed Drain Currenta
Linear Derating Factor
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)




TC = 25
TA = 25


for 10 s
EAS
IAR
EAR
PD
dV/dt
TJ, Tstg
0.33
0.020
310
- 3.6
4.2
42
2.5
- 5.0
- 55 to + 150
260d
W/
mJ
A
mJ
W
V/ns





Description

Third Power MOSFETs technology in DPAK is the key to Vishay advanced line of Power MOSFET transistors. The efficient geometry and unique processing of the Power MOSFETs design achieve very low on-state resistance combined with high transconductance and extreme device ruggedness.

The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU/SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications.






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