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TFDU2201

Features: • Package dimension: L 7.3 mm x W 4.55 mm x H 2.75 mm• SMD side view• Fast PIN Photodiode for SIR and FIR applications• Detector with high efficiency and high speed at low bias voltage• Only 30 mA IRED peak current during transmission for IrDA SIR low power ...

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SeekIC No. : 004518016 Detail

TFDU2201: Features: • Package dimension: L 7.3 mm x W 4.55 mm x H 2.75 mm• SMD side view• Fast PIN Photodiode for SIR and FIR applications• Detector with high efficiency and high speed...

TFDU2201 Data Sheet

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Part Number:
TFDU2201
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Package dimension: L 7.3 mm x W 4.55 mm x H 2.75 mm
• SMD side view
• Fast PIN Photodiode for SIR and FIR applications
• Detector with high efficiency and high speed at low bias voltage
• Only 30 mA IRED peak current during transmission for IrDA SIR low power standard
• Lead(Pb)-free device
• Device in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC


Application

• Mobile Phones, Pagers, Personal Digital Assistants (PDA)
• Handheld battery operated equipment


Specifications

Parameter
Test Conditions
Symbol
Min
Typ.
Max
Unit
Photo pin diode, reverse voltage range
Vr
- 0.3
12
V
Photo pin diode, reverse photo current
10
mA
Average IRED current
IIRED(DC)
100
mA
Repetitive pulsed IRED current
< 90 s, ton < 20 %
IIRED(RP)
550
mA
IRED, reverse voltage range
VrIRED
- 0.3
5
V
Power dissipation
see Figure 3
Ptot
200
mW
Juntion temperature
TJ
125
°C
Ambient temperature range
(operating)
Tamb
- 25
+ 85
°C
Storage temperature range
Tstg
- 40
+ 85
°C
Soldering temperature
t = 20 s @ 215 °C, see Vishay
Telefunken IrDA Design Guide
215
240
°C
Virtual source size
Method: (1 - 1/e) encircled
energy
d
2
mm
Compatible to Class 1 opration of IEC 60825 or EN60825 with worst case IrDA SIR pulse pattern, 115.2 kbit/s


Description

The miniaturized TFDU2201 is an ideal PIN photodiode transmitter combination in a unique package for applications in telecommunications like mobile phones and pagers. The device is mechanically designed for lowest profile with a height of only 2.8 mm. The device is designed to be compatible to the IrDA standard when using an external receiver IC and IRED driver.




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