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MFG:.  Package Cooled:.  D/C:07+  

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Part Number: TLBGA1100

 

MFG: .

Package Cooled: .

D/C: 07+

 

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TLBGA1100 Maximum Ratings

Product Name
Forward Current
IF (mA)
Please see Note 1
Power Dissipation
PD(mW)
Operating
Temperature
Topr()
Storage
Temperature
Tstg()
TLBGA1100
30
126
-40~100
-40~100
TLRPA1100

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating

TLBGA1100 Features

• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• UV LED chip + RGB phosphor
• Colors: bluish green, reddish purple
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible
• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• UV LED chip + RGB phosphor
• Colors: bluish green, reddish purple
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible

TLBGA1100 Typical Application

• automotive use, backlighting, etc.

TLBGA1100 datasheet

TLBGA1100
PDF/DataSheet Download

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