MFG:TOSHIBA Package Cooled:SMD D/C:09+
MFG: TOSHIBA
Package Cooled: SMD
D/C: 09+
Description: The TOSHIBA TLP176G consists of gallium arsenide infrared emitting diode optically coupled to a photoM...
The TOSHIBA TLP176G consists of gallium arsenide infrared emitting diode optically coupled to a photoMOS FET in a SOP, which is suitable for surface mount assembly. The TLP176G is suitable for the modem applications which require
space savings.
| Characteristic | Symbol | Rating | Unit | |
| LED | Forward current Forward current derating (Ta25) Pulse forward current(100s pulse,100pps) Reverse voltage Junction temperature |
I F IF/ IFP VR Tj |
60 0.7 1 5 125 |
mA |
| Detector | Offstate output terminal voltage Onstate current Onstate current derating (Ta 25) Junction temperature |
VOFF ION ION/ Tj |
35 120 1.2 125 |
V mA mW mA/ |
| Storage temperature range | Tstg | 55~125 | ||
| Operating temperature range | Topr | 40~85 | ||
| Lead soldering temperature (10s) | Tsol | 260 | ||
| Total package power dissipation | PT | 350 | mW | |
| Total package power dissipation derating (Ta25) | PT/ | -0.35 | mW / | |
| Isolation voltage (AC,1min., R.H.60%) (Note1) | BVS | 1500 | Vrms | |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(Note 1): Device considered a twoterminal device: Pin 1 and 2 shorted together and pin 3 and 4 shorted together.
TLP176G
PDF/DataSheet Download
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PHOTOCOUPLER GAAS IRED/FET 4-SOP
The TOSHIBA TLP176D consists of gallium arsenide infrared emittingdiode optically coupled to a photo-MOSFET in a SOP, which is suitable forsurface mount assembly.The TLP176D is suitable for modem and PBX applicationswhichrequirespace savings.
PHOTOCOUPLER GAAS IRED 4-SOP
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PHOTOCOUPLER GAAS IRED/FET 4-SOP
The TLP176A consist of gallium arsenide infrared emitting diode optically coupled to a photo-MOS FET in s SOP,which is suitable for surface mount assembly.It is suitable for replacement of mechanical relays in many applications which require space savings. ...
The TLP176 is designed as TOSHIBA photocoupler which consists of gallium arsenide infrared emitting diode optically coupled to a photo-MOSFET in a SOP, which is suitable for surface mount assembly. It is suitable for replacement of mechanical relays in many ...
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