TLV2352

Supply voltage, VDD (see Note 1)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Differential input voltage, VID (see Note 2)  . . . . . . . . . . . . . . . . . . . . . .. . . ±8 V
Input voltage range, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 8 V
Output voltage, V_O  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 V
Input current, I_I  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±5 mA
Output current, I_O  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . .20 mA
Duration of output short-circuit current to GND (see Note 3)  . . . . . . . . .unlimited
Continuous total power dissipation . . . . . . . . . . . . . .See Dissipation Rating Table
Operating free-air temperature range, T_A: TLV2352I  . . . . . . . ... .. .40 to 85
                                                                    TLV2352M  . . . . . . .. . .55 to 125
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . .65 to 150
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds:
                                                                           D, P, and PW Packages . . . . 260
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds:
                                                                           FK, JG, and U Packages  . . . . 300
† Stress beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN .
3. Short circuits from outputs to VDD can cause excessive heating and eventual device destruction.