TLWA1100

Features: • Surface-mount devices• 3.2 (L) × 2.9 (W) × 1.9 (H) mm• UV LED chip + RGB phosphor• Luminous intensity : Iv = 100 mcd (typ.) @20mA• Colors: White• Chromaticity (typ.) : Cx=0.33,Cy=0.32• Topr / Tstg = -40 to 100°C• Reflow soldering is possi...

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SeekIC No. : 004522814 Detail

TLWA1100: Features: • Surface-mount devices• 3.2 (L) × 2.9 (W) × 1.9 (H) mm• UV LED chip + RGB phosphor• Luminous intensity : Iv = 100 mcd (typ.) @20mA• Colors: White• Chro...

floor Price/Ceiling Price

Part Number:
TLWA1100
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/5/11

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Product Details

Description



Features:

• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• UV LED chip + RGB phosphor
• Luminous intensity : Iv = 100 mcd (typ.) @20mA
• Colors: White
• Chromaticity (typ.) : Cx=0.33,Cy=0.32
• Topr / Tstg = -40 to 100°C
• Reflow soldering is possible
• Applications: automotive use,
                        backlighting, etc.
• Standard embossed tape packing: T11 (2000/reel)
                                                          8-mm tape reel



Specifications

Characteristic Symbol
Rating
Unit
Forward Current (Note 1)
IF
30
mA
Power Dissipation
PD
126
mW
Operating Temperature
Topr
-40 ~ 100
Storage Temperature
Tstg
-40 ~ 100

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating



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