Features: Advanced trench process technologyLow gate chargeHigh Density Cell Design for Ultra Low On-ResistanceFully Characterized Avalanche Voltage and Current High performance technology for low RDS(ON)Fast switching speedSpecifications Parameter Symbol Limit Unit Drain-Source V...
TSM12N02: Features: Advanced trench process technologyLow gate chargeHigh Density Cell Design for Ultra Low On-ResistanceFully Characterized Avalanche Voltage and Current High performance technology for low R...
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| Parameter |
Symbol |
Limit |
Unit | |
| Drain-Source Voltage |
VDSS |
20 |
V | |
| Gate-Source Voltage |
VGSS |
±12 |
V | |
| Continuous Drain Current |
ID |
12 |
A | |
| Pulsed Drain Current |
IDM |
30 | ||
| Maximum Power Dissipation | TA = 25 |
PD |
1.3 |
W |
| TA = 100 |
2 |
W/ | ||
| Operating Junction Temperature |
TJ |
+150 |
||
| Operating Junction and Storage Temperature Range |
TJ, TSTG |
-55 to +150 |
||