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TSM4392

Features: Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistanceApplication High-Side DC/DC Conversion Notebook SeverSpecifications Parameter Symbol Limit Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 V Contin...

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SeekIC No. : 004529672 Detail

TSM4392: Features: Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistanceApplication High-Side DC/DC Conversion Notebook SeverSpecifications Parameter Symbol Limit...

TSM4392 Data Sheet

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Part Number:
TSM4392
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/17

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Product Details

Description



Features:

Advance Trench Process Technology
High Density Cell Design for Ultra Low On-resistance


Application

High-Side DC/DC Conversion
Notebook
Sever


Specifications

Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
 ±20
V
Continuous Drain Current
ID
12.5
A
Pulsed Drain Current
IDM
50
A
Continuous Source Current (Diode Conduction)a,b
IS
2.7
Maximum Power Dissipation Ta = 25
PD
3.0
W
Ta = 75
1.9
Operating Junction Temperature
TJ
+150
Operating Junction and Storage Temperature Range
TJ, TSTG
- 55 to +150



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