Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color type• RoHSApplication• Automotive: backlighting in dashboard and switch• Telecomm...
TSP1-FF1608H6-2630: Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color...
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|
Characteristics |
Symbol |
Rating |
Unit |
| Reverse Voltage |
VR |
5 |
V |
| Forward Current |
IF |
25 |
mA |
| Operating temperature |
Topr |
-40~85 |
|
| Storage temperature |
Tstg |
-40~90 |
|
| Electrostatic Discharge |
ESD |
150 |
V |
| Power dissipation |
PD |
110 |
Wm |
| Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
100 |
mA |
| Soldering Temperature |
Tsol |
Reflow Soldering:260 for 10 sec. | |
| Hand Soldering: 350 for 3 sec. | |||
• The TSP1-FF1608H6-2630 SMD series enable smaller board size, higher packing density,reduced storage space, and small equipment.
• Besides, light weight makes them ideal for miniature applications.