Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color type• RoHS complianceApplication• Automotive: Backlighting in dashboard and switch̶...
TSP1-WF1608H6S2T3: Features: • Package in 8mm tape on 7 diameter reel• Compatible with automatic placement equipment• Compatible with infrared and vapor phase reflow solder process• Mono-color...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
| Parameter | Symbol | Value | Unit |
| Reverse Voltage | VR | 5 | V |
| Forward Current | IF | 25 | mA |
| Power Dissipation | Pd | 110 | mW |
| Electrostatic Discharge (HBM) | ESD | 150 | V |
| Soldering Temperature | Tsol | 260 for 5 seconds | |
| Operating Temperature | Topr | -40 ~ +85 | |
| Storage Temperature | Tstg | -40 ~ +90 | |
| Peak Forward Current (Duty 1/10 @1KHz) |
IF | 100 | mA |
• The TSP1-WF1608H6S2T3 SMD series enables smaller board size, higher packing density, reduced storage space, and small equipment
• Besides, light weight makes them ideal for miniature applications