UC2843AQ

V_CC voltage (low impedance source) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
V_CC voltage (I_CC mA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . self limiting
Output current, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A
Output energy (capacitive load) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . 5 J
Analog Inputs (pins 3, 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6.3 V
Error Amp Output Sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Power Dissipation at T_A < +25 (D package) . . . . . . . . . . . . . . . . . . . . . . . . . . .  1 W
Package thermal impedance, _JA (see Note 1): D (8-pin) package . . . . . . . . 97°C/W
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 to 150
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . 260

† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals.
NOTE 1: Long term hightemperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.