UDN-2545B

Features: SpecificationsDescriptionThe UDN-2545B has the following features including Output Current of 2 A;80 V Min. Output Breakdown;40 V Output Sustaining Voltage;PMOS, CMOS, TTL Compatible;Built-in Thermal Shutdown;Output Transient Protection;CHIP ENABLEfor Microprocessor Control;Under-Voltage...

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SeekIC No. : 004536270 Detail

UDN-2545B: Features: SpecificationsDescriptionThe UDN-2545B has the following features including Output Current of 2 A;80 V Min. Output Breakdown;40 V Output Sustaining Voltage;PMOS, CMOS, TTL Compatible;Built...

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Part Number:
UDN-2545B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:






Specifications






Description

The UDN-2545B has the following features including Output Current of 2 A;80 V Min. Output Breakdown;40 V Output Sustaining Voltage;PMOS, CMOS, TTL Compatible;Built-in Thermal Shutdown;Output Transient Protection;CHIP ENABLEfor Microprocessor Control;Under-Voltage Protection.

The UDN-2545B is a four-channel high-current,high-voltage integrated circuit designed to provide the interface between stepper motors and microprocessor or logic motor control circuitry. The UDN-2545B will accept most standard logic signal inputs and provide motor drive current to both positive and negative supply rails.The UDN-2545B is capable of sinking up to 2.5A and maintaining an output OFF voltage of 80 volts. This device incorporates some unique features such as under-voltage protection,thermal shutdown,and CHIP ENABLE control.The under-voltage protection guards against supply line transients and has built-in hystersis. The thermal shutdown with hystersis is to guard against damage to the device. CHIP ENABLE is especially good for use in microprocessor control. All outputs have clamp diodes for suppression of inductive loads.The UDN-2545B is supplied in a 16 pin plastic dual in-line package with heat-sink contact tabs. A copper-alloy lead frame provides maximum power dissipation using standard cooling methods. This lead configuration facilitates attachment of external heat sinks for increased power dissipation with standard IC sockets and printed wiring boards.

The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the Sensitron Semiconductor sales department for the latest version of the datasheet(s).In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,medical equipment, and safety equipment), safety should be ensured by using semiconductor devices that feature assured safety or by means of users' fail-safe precautions or other arrangement.

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