UGN-3035U

The UGN-3035U has the following features including Extreme Sensitivity;For Use with Multipole Ring Magnets;High Reliability-No Moving Parts;Small Size;Output Compatible with All Digital Logic Families;Symmetrical Output.

DEVELOPED for use with multipole ring magnets in applications requiring extreme sensitivity to magnetic field reversal, the Type UGN-30350 Hall Effect latch assembly provides rugged, reliable interface between electromechanical equipment and bipolar or MOS logic circuits at switching frequencies of up to 100 kHz.The bipolar output of the magnetically biased device saturates when the Hall cell is exposed to a magnetic flux density greater than the ON threshold(25 G typical, 50 G maximum). The output transistor remains in the ON state until magnetic field reversal exposes the Hall cell to a magnetic flux density below the OFF threshold(-25 G typical,-50 G minimum). Because the operating state switches only with magnetic field reversal, and not merely with a change in its strength, the integrated circuit qualifies as a true Hall Effect latch.

Under power-up conditions, and in the absence of an externally applied magnetic field, the output transistnr of mnst IT(:N-'i0'iSi1 assemblies is ON and capable of sinking 25 mA of current. This is, however, a formally ambiguous state and should be treated as such.In normal operation, the output transistor turns ON as the strength of the magnetic field perpendicular to the surface of the chip reaches the Operate Point. The output transistor switches OFF as magnetic field reversal takes magnetic flux density to the Release Point.Note that the device latches: That is, a south pole of sufficient strength, presented to the branded face of the assembly, turns the device ON. Removal of the south pole leaves the device ON. The presence of a north magnetic pole of sufficient strength is required to turn the switch OFF.All Hall Effect integrated circuits are susceptible to mechanical stress effects. Caution should be exercised to minimize the application of stress to the leads or the epoxy package.Use of epoxy glue is recommended. Other types may deform the epoxy package.