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UH3D

Features: • Low profile package• Ideal for automated placement• Oxide planar chip junction• Ultrafast recovery times for high frequency• Meets MSL level 1, per J-STD-020, LF maximum peak of 260• Solder dip 260, 40 s• Component in accordance to RoHS 2002/95...

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SeekIC No. : 004536942 Detail

UH3D: Features: • Low profile package• Ideal for automated placement• Oxide planar chip junction• Ultrafast recovery times for high frequency• Meets MSL level 1, per J-STD-02...

UH3D Data Sheet

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Part Number:
UH3D
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• Low profile package
• Ideal for automated placement
• Oxide planar chip junction
• Ultrafast recovery times for high frequency
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260
• Solder dip 260, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC




Application

For use in secondary rectification and freewheeling for ultrafast switching speeds of ac-to-ac and dc-to-dc converters in high temperature conditions for both consumer and automotive applications.






Specifications

PARAMETER
SYMBOL
UH3B
UH3C
UH3D
UNIT
Device marking code
HB
HC
HD
Maximum repetitive peak reverse voltage
VRRM
100
150
200
V
Maximum average forward rectified current (Fig. 1)
IF(AV)
2.5 (1)
3.0 (2)
A
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load
IFSM
80
A
Operating junction and storage temperature range
TJ, TSTG
- 55 to + 175
Notes:
(1) Free air, mounted on recommended copper pad area
(2) Units mounted on P.C.B. with 0.31 x 0.31" (8.0 x 8.0 mm) copper pad area




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