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UPG2030TB

RF Switch ICs RO 551-UPG2030TB-A

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SeekIC No. : 00632362 Detail

UPG2030TB: RF Switch ICs RO 551-UPG2030TB-A

UPG2030TB Data Sheet

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Part Number:
UPG2030TB
Mfg:
NEC/CEL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/12

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Product Details

Quick Details

Mounting Style : SMD/SMT Package / Case : S06    

Description

Number of Switches :
Switch Configuration :
Insertion Loss :
Off Isolation (Typ) :
Maximum Operating Temperature :
Minimum Operating Temperature :
Packaging :
Mounting Style : SMD/SMT
Package / Case : S06


Features:

· SWITCH CONTROL VOLTAGE:
    Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.)
    Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
· LOW INSERTION LOSS:
    LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 2.8 V/0 V
    LINS2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont = 2.8 V/0 V
    LINS3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V
· HIGH ISOLATION:
    ISL1 = = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 2.8 V/0 V
    ISL2 = 24 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V
· POWER HANDLING:
    Pin (0.1 dB) = +27.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V
    Pin (1 dB) = +30.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V
    (Reference value)
· HIGH-DENSITY SURFACE MOUNTING:
    6-pin super minimold package (2.0 × 1.25 × 0.9 mm)


Application

· L, S-band digital cellular or cordless handsets
· PCS, W-LAN, WLL and BluetoothTM etc.
· Short Range Wireless


Pinout

Connection Diagram


Specifications

Parameter
Symbol
Ratings
 Unit
Switch Control Voltage
Vcont
6.0
V
Input Power
Pin
+33
dBm
Operating Ambient Temperature
TA
-45 to +85
°C
Storage Temperature
Tstg
-55 to +150
°C



Description

NEC's UPG2030TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications.

This device UPG2030TB can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation.

This device UPG2030TB is housed in a 6-pin super minimold package, suitable for high-density surface mounting.




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