V048F040T050

Features: • 48 V to 4 V V•I Chip Converter• 50 A (75 A for 1 ms)• High density 182 A/in3• Small footprint 45 A/in2• Low weight 0.5 oz (14 g)• Pick & Place / SMD• 125 operation• 1 s transient response• 3.5 million hours MTBF• ...

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V048F040T050 Picture
SeekIC No. : 004539475 Detail

V048F040T050: Features: • 48 V to 4 V V•I Chip Converter• 50 A (75 A for 1 ms)• High density 182 A/in3• Small footprint 45 A/in2• Low weight 0.5 oz (14 g)• Pick & ...

floor Price/Ceiling Price

Part Number:
V048F040T050
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/3/27

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Product Details

Description



Features:

• 48 V to 4 V V•I Chip Converter
• 50 A (75 A for 1 ms)
• High density 182 A/in3
• Small footprint 45 A/in2
• Low weight 0.5 oz (14 g)
• Pick & Place / SMD
• 125  operation
• 1 s transient response
• 3.5 million hours MTBF
• Typical efficiency 94%
• No output filtering required



Application

In applications requiring higher current or redundancy, VTMs can be operated in parallel without adding control circuitry or signal lines. To maximize current sharing accuracy, it is imperative that the source and load impedance on each VTM in a parallel array be equal. If VTMs are being fed by an upstream PRM, the VC nodes of all VTMs must be
connected to the PRM VC.

To achieve matched impedances, dedicated power planes within the PC board should be used for the output and output return paths to the array of paralleled VTMs. This technique is preferable to using traces of varying size and length.

The VTM power train and control architecture allow bi-directional power transfer when the VTM is operating within its specified ranges. Bi-directional power processing improves transient response in the event of an output load dump. The VTM may operate in reverse, returning output power back to the input source. It does so efficiently.




Pinout

  Connection Diagram


Specifications

Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.5 to 12
Vdc
Isolation voltage
2.250
Vdc
Input to Ouput
Output current
50
A
Continuous
Peak output current
75
A
For 1 ms
Output power
220
W
Continuous
Peak output power
330
W
For 1 ms
Case temperature
208

During reflow
Operating junction temperature
-40 to 125
-55 to 125

T - Grade
M - Grade
Storage temperature
-40 to 150
-65 to 150

T - Grade
M - Grade

Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature
      is monitored by a shutdown comparator.


Description

The V048F040T050 V•I Chip Voltage Transformation Module (VTM) excels at speed, density and efficiency to meet the demands of advanced power applications while providing isolation from input to output. It achieves a response time of less than 1 s and delivers up to 50 A in a volume of less than 0.274 in3 with unprecedented efficiency. It may be paralleled to deliver higher power levels at an output voltage settable from 2.17 to 4.58 Vdc.

The VTM V048F040T050's nominal output voltage is 4 Vdc from a 48 Vdc input Factorized Bus, Vf, and is controllable from 2.17 to 4.58 Vdc at no load, and from 1.98 to 4.40 Vdc at full load, over a Vf input range of 26 to 55 Vdc. It can be operated either open- or closed-loop depending on the output regulation needs of the application. Operating open-loop, the output voltage tracks its Vf input voltage with a transformation ratio, K = 1/12, for applications requiring an isolated output voltage with high efficiency. Closing the loop back to an input Pre-Regulation Module (PRM) or DC-DC converter enables tight load regulation.

The V048F040T050 achieves a current density of 182 A/in3 in a V•I Chip package compatible with standard pick-andplace and surface mount assembly processes. The V048F040T050's fast dynamic response and low noise eliminate the need for bulk capacitance at the load, substantially increasing system density while improving reliability and decreasing cost.




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