V300C12C500A

Features: • DC input range: 36 - 75V• Input surge withstand: 100V for 100ms• DC output: 12V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full load• Efficiency: 85.7%• Maximum operating temperature:100°C at full load• Power density: ...

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SeekIC No. : 004539738 Detail

V300C12C500A: Features: • DC input range: 36 - 75V• Input surge withstand: 100V for 100ms• DC output: 12V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full loadR...

floor Price/Ceiling Price

Part Number:
V300C12C500A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/25

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Product Details

Description



Features:

• DC input range: 36 - 75V
• Input surge withstand: 100V for 100ms
• DC output: 12V
• Programmable output: 10 to 110%
• Regulation: ±0.2% no load to full load
• Efficiency: 85.7%
• Maximum operating temperature:  100°C at full load
• Power density: 99W/cubic inch
• Height above board: 0.43 in. (10,9 mm)
• Parallelable, with N+M fault tolerance
• Low noise ZCS/ZVS architecture



Application

telecommunications and distributed power systems


Specifications

Parameter Rating Unit Notes
+In to In voltage -0.5 to +75.0 Vdc  
+In to In voltage 100 Vdc <100ms
PC to In voltage -0.5 to +7.0 Vdc  
PR to In voltage -0.5 to +7.0 Vdc  
+Out to Out voltage -0.5 to +16.0 Vdc  
+Sense to Out voltage -0.5 to +16.0 Vdc  
Sense to Out voltage 1.0 Vdc  
SC to Out voltage -0.5 to +1.5 Vdc  
Isolation voltage (in to out) 3000 Vrms  
Isolation voltage (in to base) 1550 Vrms  
Isolation voltage (out to base) 500 Vrms  
Storage temperature (CGrade -40 to +125 °C See part numbering chart on this
page for other product grades.
Operating temperature (CGrade) -20 to +100 °C Baseplate
Pin soldering temperature 500 (260) °F (°C) <5 sec; wave solder
Pin soldering temperature 750 (390) °F (°C) <7 sec; hand solder
Mounting torque 5 (0.57) in-lbs (N-m) 6 each, # 4-40 or M3



Description

The V300C12C500A uses 2nd Generation power processing, control and packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated cavity core transforme couples widely separated primary and secondary windings, resulting in low in-to-out parasitic capacitance and noise.

High frequency ZCS/ZVS switching, V300C12C500A, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.


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