VSMS3700

Features: • Package type: surface mount• Package form: PLCC-2• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75• Peak wavelength: p = 950 nm• High reliability• Angle of half intensity: = ± 60°• Low forward voltage• Suitable for high pulse current oper...

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VSMS3700 Picture
SeekIC No. : 004543675 Detail

VSMS3700: Features: • Package type: surface mount• Package form: PLCC-2• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75• Peak wavelength: p = 950 nm• High reliability• Angl...

floor Price/Ceiling Price

Part Number:
VSMS3700
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• Peak wavelength: p = 950 nm
• High reliability
• Angle of half intensity: = ± 60°
• Low forward voltage
• Suitable for high pulse current operation
• Good spectral matching with Si photodetectors
• Package matched with IR emitter series VEMT3700
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component in accordance with
RoHS 2002/95/EC and WEEE 2002/96/EC





Application

• Infrared source in tactile keyboards
• IR diode in low space applications
• PCB mounted infrared sensors
• Emitter in miniature photo-interrupters





Specifications

PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Emitter to Base Voltage
VR
5
V
Collector Current
IF
100
mA
Collector peak current tp/T 0.1, tp 10 s
IFM
200
mA
Surge forward current tp = 100 s
IFSM
1.5
A
Power dissipation
PV
170
mW
Junction Temperature
Tj
100
Operating ambient temperature
Tamb
- 40 to + 85
Storage temperature range
Tstg
- 40 to + 100
Soldering temperature acc. figure 11, J-STD-020
Tsd
260
Thermal resistance junction/ambient J-STD-051, soldered on PCB
RthJA
250
K/W


Note
Tamb = 25 , unless otherwise specified






Description

VSMS3700 is an infrared, 950 nm emitting diode in GaAs technology, molded in a PLCC-2 package for surface mounting (SMD).






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