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VUM33-05

Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast boost diode Kelvin source for easy driveApplication Power factor pre-conditioner for SMPS, UPS, ba...

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VUM33-05: Features: Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast ...

VUM33-05 Data Sheet

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Part Number:
VUM33-05
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

Package with DCB ceramic base plate
Soldering connections for PCB mounting
Isolation voltage 3600 V~
Low RDS(on) HDMOSTM process
Low package inductance for high speed switching
Ultrafast boost diode
Kelvin source for easy drive


Application

Power factor pre-conditioner for SMPS, UPS, battery chargers and inverters
Boost topology for SMPS including 1~ rectifier bridge
Power supply for welding equipment



Specifications

Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
VGS
ID
ID
IDM
PD
IS
ISM
VRRM
IdAV
IFSM



P
VRRM
IdAV
IFSM



P
TVJ
TJM
Tstg
VISOL

Md
Weight
TVJ = 25 to 150
TVJ = 25 to 150; RGS = 10 k
Continuous
TS = 85
TS = 25
TS = 25, tp = o
TS = 85
VGS = 0 V, TS = 25
VGS = 0 V, TS = 25, tp = o

TS = 85, rectangular = 0.5
TVJ = 45, t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
TVJ = 150, t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
TS = 85

TS = 85, sinus 180o
TVJ = 45, t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
TVJ = 150,t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
TS = 85


50/60 Hz t = 1 min
IISOL  1 mA t = 1 s
Mounting torque (M5)
500 V
500 V
±20 V
33A
47A
130 A
310 W
33A
130 A
600 V
33 A
800 V
54 A
300 A
320 A
260 A
280 A
59W
300 A
320 A
260 A
280 A
50W
-40...+150
150
-40...+150
3000 V~
3600 V~
2-2.5/18-22 Nm/lb.in.
28 g



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