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W3EG6432S-D4

Features: · DDR200, DDR266 and DDR333• JEDEC design specifi cations· Double-data-rate architecture· Industrial temperature· Bi-directional data strobes (DQS)· Differential clock inputs (CK & CK#)· Programmable Read Latency 2,2.5 (clock)· Programmable Burst Length (2,4,8)· Programmable Bu...

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SeekIC No. : 004544702 Detail

W3EG6432S-D4: Features: · DDR200, DDR266 and DDR333• JEDEC design specifi cations· Double-data-rate architecture· Industrial temperature· Bi-directional data strobes (DQS)· Differential clock inputs (CK &am...

W3EG6432S-D4 Data Sheet

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Part Number:
W3EG6432S-D4
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· DDR200, DDR266 and DDR333
• JEDEC design specifi cations
· Double-data-rate architecture
· Industrial temperature
· Bi-directional data strobes (DQS)
· Differential clock inputs (CK & CK#)
· Programmable Read Latency 2,2.5 (clock)
· Programmable Burst Length (2,4,8)
· Programmable Burst type (sequential & interleave)
· Edge aligned data output, center aligned data input
· Auto and self refresh
· Serial presence detect
· Power supply: 2.5V ± 0.20V
· Industrial temperature options
· Standard 200 pin SO-DIMM package
• Package height option:
D4: 31.75mm (1.25")


Specifications

Parameter Symbol Value Units
Voltage on any pin relative to VSS VIN, VOUT -0.5 to 3.6 V
Voltage on VCC supply relative to VSS VCC, VCCQ -1.0 to 3.6 V
Storage Temperature TSTG -55 to +150 °C
Power Dissipation PD 8 W
Short Circuit Current IOS 50 mA
Note:
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability


Description

The W3EG6432S-D4 is a 32Mx64 Double Data Rate SDRAM memory module based on 256Mb DDR SDRAM components. The W3EG6432S-D4 consists of eight 32Mx8 DDR SDRAMs in 66 pin TSOP packages mounted on a 200 pin FR4 substrate.

Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges and Burst Lengths allow the same device to be useful for a variety of high bandwidth, high performance memory system ap pli ca tions.




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