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WEDPDC3225-B

Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Ball pads diameter and ball attach process· Substrate dimensions, materal, process and thickness (no vias)· Die dimensions and thickness (dummy die, no wirebonds) 3 - State OutputsDescriptionThe WEDPDC32...

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SeekIC No. : 004545609 Detail

WEDPDC3225-B: Features: · 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm· Package material and assembly process· Ball pads diameter and ball attach process· Substrate dimensions, materal, process and thickness (no vi...

WEDPDC3225-B Data Sheet

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Part Number:
WEDPDC3225-B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2026/3/24

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Product Details

Description



Features:

· 25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm
· Package material and assembly process
· Ball pads diameter and ball attach process
· Substrate dimensions, materal, process and thickness (no vias)
· Die dimensions and thickness (dummy die, no wirebonds) 3 - State Outputs


Description

The WEDPDC3225-B is a mechaincal daisy-chain test vehicle designed to be representative of the 25 x 32mm, 25 x 25mm, 25 x 21mm, and 21 x 21mm packages. Use is for second level interconnection assembly test such tempature cycling, and continuity verifi cation of the PBGA to the test board when it is overfl owed.




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