Features: RDS(on) (Max 1.4 )@VGS=10V Gate Charge (Typical 25nC) Improved dv/dt Capability, High Ruggedness 100% Avalanche Tested Maximum Junction Temperature Range (150)Specifications Symbol Parameter Value Units VDSS Drain to Source Voltage 500 V ID Continuous Drain Current(@T...
WFP830: Features: RDS(on) (Max 1.4 )@VGS=10V Gate Charge (Typical 25nC) Improved dv/dt Capability, High Ruggedness 100% Avalanche Tested Maximum Junction Temperature Range (150)Specifications Symbol ...
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| Symbol | Parameter | Value | Units |
| VDSS | Drain to Source Voltage | 500 | V |
| ID | Continuous Drain Current(@TC = 25) | 5.0 | A |
| Continuous Drain Current(@TC = 100) | 3.0 | A | |
| IDM | Drain Current Pulsed (Note 1) | 20 | A |
| VGS | Gate to Source Voltage | ±30 | V |
| EAS | Single Pulsed Avalanche Energy (Note 2) | 292 | mJ |
| EAR | Repetitive Avalanche Energy (Note 1) | 8.75 | mJ |
| dv/dt | Peak Diode Recovery dv/dt (Note 3) | 5.5 | V/ns |
| PD | Total Power Dissipation(@TC = 25) | 87.5 | W |
| Derating Factor above 25 | 0.70 | W/ | |
| TSTG, TJ | Operating Junction Temperature & Storage Temperature | - 55~150 | |
| TL | Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds. |
300 |