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WSF41632-22XX

Features: · Access times of 25ns (SRAM) and 120ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, hermetic ceramic HIP (Package 402)• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880 ) square (Package 509) 4.57mm (0.180 ) height Designed to fi t JEDEC 68 lead 0.990 CQFJ footprint ...

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SeekIC No. : 004546761 Detail

WSF41632-22XX: Features: · Access times of 25ns (SRAM) and 120ns (FLASH)· Packaging• 66 pin, PGA Type, 1.385 square HIP, hermetic ceramic HIP (Package 402)• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880...

WSF41632-22XX Data Sheet

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Part Number:
WSF41632-22XX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Access times of 25ns (SRAM) and 120ns (FLASH)
· Packaging
• 66 pin, PGA Type, 1.385" square HIP, hermetic ceramic HIP (Package 402)
• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height Designed to fi t JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 2). Package to be developed.
· 128Kx32 SRAM
· 512Kx32 5V Flash
· Organized as 128Kx32 of SRAM and 512Kx32 of Flash Memory with common data bus
· Low power CMOS
· Commercial, industrial and military temperature ranges
· TTL compatible inputs and outputs
· Built-in decoupling caps and multiple ground pins for low noise operation
· Weight - 13 grams typical




Pinout

Connection Diagram


Specifications

Parameter Symbol Min Max Unit
Operating Temperature TA -55 +125
Storage Temperature TSTG -65 +150
Signal Voltage Relative to GND VG -0.5 7.0 V
Junction Temperature TJ   150
Supply Voltage VCC -0.5 7.0 V



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