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X1000-BD

Features: ·Excellent Broadband Mixer Driver·Single Ended Fed Doubler with Distributed Buffer Amplifier·Excellent LO Driver for Mimix Receivers·+15 dBm Output Drive·100% On-Wafer RF, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vcc...

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SeekIC No. : 004547025 Detail

X1000-BD: Features: ·Excellent Broadband Mixer Driver·Single Ended Fed Doubler with Distributed Buffer Amplifier·Excellent LO Driver for Mimix Receivers·+15 dBm Output Drive·100% On-Wafer RF, DC and Output Po...

X1000-BD Data Sheet

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Part Number:
X1000-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/24

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Product Details

Description



Features:

·Excellent Broadband Mixer Driver
·Single Ended Fed Doubler with Distributed Buffer Amplifier
·Excellent LO Driver for Mimix Receivers
·+15 dBm Output Drive
·100% On-Wafer RF, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010


Specifications

Supply Voltage (Vcc) +6.0 VDC
Supply Voltage (Vss) -6.0 VDC
Supply Current (Id) 300 mA
Supply Current (Iss)

60mA

Gate Bias Voltage (Vg) +0.3 VDC
Input Power (RF Pin) +12.0 dBm
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF Table 1
Junction Temperature (Tch) MTTF Table 1


(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's single ended fed (no external balun required) 7.5-25.0/15.0-50.0 GHz GaAs MMIC doubler has a +15.0 dBm output drive and is an excellent LO doubler that can be used to drive fundamental mixer devices.  The X1000-BD is also well suited to drive Mimix's XR1002 receiver device. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The X1000-BD has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. The X1000-BD is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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