XCB170

Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 3750VRMS Input/Output Isolation• No EMI/RFI Generation• Machine Insertable, Wave Solderabl...

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XCB170 Picture
SeekIC No. : 004548095 Detail

XCB170: Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 37...

floor Price/Ceiling Price

Part Number:
XCB170
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/26

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Product Details

Description



Features:

• Small 6 Pin DIP Package
• Low Drive Power Requirements (TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• 3750VRMS Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount and Tape & Reel Versions Available



Application

• UL Recognized: File Number E76270
• CSA Certified: File Number LR 43639-10
• BSI Certified to:
• BS EN 60950:1992 (BS7002:1992) Certificate #: 7344
• BS EN 41003:1993 Certificate #: 7344



Specifications

Parameter Min Typ Max Units
Input Power Dissipation - - 1501 mW
Input Control Current
Peak (10ms)
-
-
- 50
1
mA
A
Reverse Input Voltage - - 5 V
Total Power Dissipation - - 8002 mW
Isolation Voltage
Input to Output
3750 - - VRMS
Operational Temperature -40 - +85
Storage Temperature -40 - +125
Soldering Temperature
DIP Package
Surface Mount Package
(10 Seconds Max.)
-
-
- +260
+220




Description

The XCB170 is a 1-Form-B relay which uses optically coupled MOSFET technology to provide 3750V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare's patented OptoMOS® architecture. A highly efficient GaAIAs infrared LED controls the optically coupled input. The XCB170 device is available in small 6-pin dual in line package in standard through hole and surface mount lead bend.




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