DescriptionThe features of XPC860DEZP50C1 are: (1)Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs); (2)Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits); (3)32 address lines; (4)Operates at up ...
XPC860DEZP50C1: DescriptionThe features of XPC860DEZP50C1 are: (1)Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs); (2)Up to ...
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The features of XPC860DEZP50C1 are: (1)Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs); (2)Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits); (3)32 address lines; (4)Operates at up to 80 MHz; (5)Memory controller (eight banks); (6)General-purpose timers; (7)System integration unit (SIU).
The following is about the absolute maximum ratings of XPC860DEZP50C1: (1)Supply Voltage: -0.3 to 4.0V; (2)Input Voltage: GND 0.3 to VDDH V; (3)Temperature (Standard): 0°C min and 95°C max; (4)Temperature 3 (Extended): 40 °C min and 95 °C; (5)Storage Temperature Range: 55 to 150 °C.
The electrical characteristics of the XPC860DEZP50C1 are: (1)Operating Voltage at 40 MHz or Less: 3.0 V min and 3.6 V max; (2)Operating Voltage Greater than 40 MHz: 3.135 V min and 3.465 V max; (3)Input High Voltage (All Inputs Except EXTAL and EXTCLK): 2.0V min and 5.5 V max; (4)Input Low Voltage: GND min and 0.8 V max; (5)EXTAL, EXTCLK Input High Voltage: 0.7* (VDDH)V min and VDDH + 0.3 V max; (6)Input Leakage Current, Vin = 5.5 V (Except TMS, TRST, DSCK, and DSDI Pins): 100 A max; (7)Input Leakage Current, Vin = 3.6 V (Except TMS, TRST, DSCK, and DSDI Pins): 10 A max.