XRD54L12

V_DD to GND . . . . . . . . . . . . . . . . . . . . .. . -0.3V, +5V
Digital Input Voltage to GND . . . . -0.3V, V_DD +0.3V
V_REFIN . . . . . . . . . . . . . . . . . . . . . -0.3V, V_DD +0.3V
V_OUT¹ . . . . . . . . . . . . . . . . . . . . . . . . . . . V_DD, GND
Continuous Current, Any Pin . . . . . .-20mA, +20mA
Package Power Dissipation Ratings (T_A= +70°C)
PDIP (derate 9mW/°C above +70°C) . . . . 117mW
SOIC (derate 6mW/°C above +70°C) . .. .155mW
Operating Temperature Range. ...-40°C to + 85°C
Storage Temperature Range . . . . -65°C to +165°C
Lead Temperature (soldering, 10 sec) . . . .. . +300°C


Notes
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100ms.